Grid array connection device and method

ABSTRACT

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

PRIORITY APPLICATIONS

This application is a divisional of U.S. application Ser. No.12/714,310, filed Feb. 26, 2010, which is a divisional of U.S.application Ser. No. 11/167,922, filed Jun. 27, 2005, now issued as U.S.Pat. No. 7,670,951, which are incorporated herein their entirety byreference.

TECHNICAL FIELD

The present invention relates generally to electronic connectionstructures. In particular, the present invention relates to devices andmethods for grid array connection structures between chip packages andcircuit boards.

BACKGROUND

Semiconductor chips such as processor chips are housed in chip packages,which are subsequently attached to circuit boards in the manufacture ofa number of electronic devices. These devices, include personalcomputers, handheld computers, mobile telephones, and other numerousinformation processing devices. One common configuration of input/outputconnections between chip packages and adjacent circuit boards includesgrid array connection structures. Examples of such connection structuresinclude land grid array structures and ball grid array structures.

There are a number of design concerns that are taken into account whenforming grid arrays. High mechanical strength and reliability of thegrid array connections are desirable. Some devices, for example mobiletelephones, are frequently subject to high shock if a user drops theirtelephone. Other design concerns include ease of manufacturability, andlow manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a chip assembly according to one embodiment of theinvention.

FIG. 2 illustrates an input/output grid array according to oneembodiment of the invention.

FIG. 3A illustrates an input/output structure according to oneembodiment of the invention.

FIG. 3B illustrates an input/output interface according to oneembodiment of the invention.

FIG. 4 illustrates a chip assembly according to one embodiment of theinvention.

FIG. 5A illustrates an input/output structure in process according toone embodiment of the invention.

FIG. 5B illustrates a microstructure of a portion of an input/outputstructure in process according to one embodiment of the invention.

FIG. 5C illustrates an input/output structure according to oneembodiment of the invention.

FIG. 5D illustrates a microstructure of a portion of an input/outputstructure according to one embodiment of the invention.

FIG. 6 illustrates a method of forming a grid array connection structureaccording to one embodiment of the invention.

FIG. 7 illustrates an electronic system according to one embodiment ofthe invention.

DETAILED DESCRIPTION

In the following detailed description of the invention reference is madeto the accompanying drawings which form a part hereof, and in which areshown, by way of illustration, specific embodiments in which theinvention may be practiced. In the drawings, like numerals describesubstantially similar components throughout the several views. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the invention. Other embodiments may be utilized,and structural, logical, and electrical changes, etc. may be made,without departing from the scope of the present invention. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the invention should be determined with reference tothe appended claims, along with the full scope of equivalents to whichsuch claims are entitled. The drawings are not drawn to scale unlessspecifically noted.

FIG. 1 shows a chip assembly 100. A chip package 110 is shown mounted toan adjacent circuit board 120. In one embodiment, as shown in FIG. 1, agrid array socket 140 is included with a number of input/outputconnections 130 located between the chip package 110 and the circuitboard 120. In one embodiment, the grid array socket 140 includes a landgrid array socket.

FIG. 2 shows a bottom side of the chip package 110. A mating half 112 ofa number of chip connection structures is shown on the chip package 110.In one embodiment, the mating halves 112 include land grid array padsurfaces. In one embodiment, the mating halves 112 include ball gridarray structures such as solder balls. In one embodiment, mating halves112 make up a portion of input/output connections 130 as shown in FIG.1.

FIG. 3A shows a land grid array structure 300. In one embodiment, theland grid array structure is included in at least one of the matinghalves 112 on a chip package 110 as shown in FIG. 2. As will bediscussed in more detail below, in one embodiment, an input/outputconnection between a chip package and an adjacent circuit board includesa land grid array structure 300 and a land grid array pin (330 in FIG.3B) that forms an electrical contact with the land grid array structure300.

FIG. 3A shows a portion of a chip package 302 with an electricalconnection structure 320. In one embodiment, the electrical connectionstructure 320 is located adjacent to an opening 304 in the chip package302. In one embodiment, the electrical connection structure 320 includesa metallic connection surface, for example a copper or copper containingsurface. Further shown in FIG. 3A are interface layers 310. A firstlayer 312, a second layer 314, and a third layer 316 are shown in FIG.3A.

In one embodiment the first layer 312 includes nickel. In one embodimentthe first layer 312 includes nickel and phosphorous. In one embodiment,the nickel in the first layer 312 is deposited on the electricalconnection structure 320 using electroless deposition techniques. In oneembodiment, the electroless deposition uses a chemical reaction todeposit the first layer 312, which results in an alloy of nickel andphosphorous deposited as the first layer 312. In one embodiment, thefirst layer is deposited to a thickness of between 5 and 8 μm.

In one embodiment, the second layer 314 includes palladium. In oneembodiment, the second layer includes palladium and phosphorous. In oneembodiment, the palladium in the second layer 314 is deposited on thefirst layer 312 using electroless deposition techniques. In oneembodiment, the electroless deposition uses a chemical reaction todeposit the second layer 314, which results in an alloy of palladium andphosphorous deposited as the second layer 314.

In one embodiment, the second layer 314 is deposited to a thickness ofapproximately 100 nm. In one embodiment, the second layer issubstantially amorphous. In one embodiment, the second layer issubstantially amorphous on a nanometer scale dimension. Advantages of aamorphous microstructure include increased hardness over alternativecrystalline structures. Increased hardness allows a deposited layer tobe deposited thinner than alternative crystalline layers, whilemaintaining desired mechanical characteristics, If desired, an amorphouslayer can be deposited to similar thicknesses of crystalline layers withimproved mechanical characteristics. In one embodiment, the amorphousmicrostructure is substantially non-porous. A non-porous microstructureprovides a further advantage of a continuous barrier layer overunderlying structure such as the first layer 312. Continuous, ornon-porous layers help to prevent corrosion of underlying structure suchas nickel in an embodiment of the first layer 312.

In one embodiment, the third layer 316 includes gold. In one embodiment,the gold in the third layer 316 is deposited on the second layer 314using electroless deposition techniques. In one embodiment, theelectroless deposition uses a gold cyanide solution to provide achemical reaction that deposits the gold in the third layer 316. In oneembodiment, the third layer 316 is deposited to a thickness ofapproximately 50-80 nm

Embodiments of the interface layers 310 as described above include anumber of advantages. As described above, embodiments of the secondlayer 314 are deposited with an amorphous microstructure that providesimproved mechanical characteristics. Further, embodiments of the secondlayer 314 provide improved corrosion resistance. These and othercharacteristics of the interface layers 310 allow a thinner depositionof gold in the third layer 316 as described above. A thinner gold layerallows a substantial price reduction in a grid array connectionstructure. Further, a thin gold layer such as 50-80 nm provides a finergrain structure than previous thicker gold layer such as 350 nm or more.The finer grain structure of present embodiments further enhancesmechanical properties such as high wear resistance.

FIG. 3B shows an example of a pin 330 contacting the interface layers310 of a grid connection structure 300 as described in embodimentsabove. A contact interface 332 is formed between the pin 330 and theinterface layers 310 allowing electrical conduction and transfer ofinformation from, for example, a chip package and a circuit board. Usingembodiments of a grid connection structure 300 as described above,increase reliability is achieved due to improved mechanicalcharacteristics such as wear resistance at the interface 332. Further,as described above, selected embodiments of the grid connectionstructure 300 are less expensive to manufacture due in part to areduction in an amount of gold used in interface layers.

FIG. 4 shows a chip assembly 400. A chip package 410 is shown mounted toan adjacent circuit board 420. In one embodiment, as shown in FIG. 4, aball grid array 430 forms a number of input/output connections locatedbetween the chip package 410 and the circuit board 420. In oneembodiment, an underfill 440 is further included between the chippackage 410 and the circuit board 420.

FIG. 5A shows a grid connection structure 500 during a manufacturingprocess. A portion of a chip package 502 is shown with an electricalconnection structure 520. In one embodiment, the electrical connectionstructure 520 is located within an opening 504 in the chip package 502.In one embodiment, the electrical connection structure 520 includes ametallic connection surface, for example a copper or copper containingsurface. Further shown in FIG. 5A are interface layers 510. A firstlayer 512, a second layer 514, and a third layer 516 are shown in FIG.5A.

In one embodiment the first layer 512 includes nickel. In one embodimentthe first layer 512 includes nickel and phosphorous. In one embodiment,the nickel in the first layer 512 is deposited on the electricalconnection structure 520 using electroless deposition techniques. In oneembodiment, the electroless deposition uses a chemical reaction todeposit the first layer 512, which results in an alloy of nickel andphosphorous deposited as the first layer 512. In one embodiment, thefirst layer is deposited to a thickness of between 5 and 8 μm.

In one embodiment, the second layer 514 includes palladium. In oneembodiment, the second layer includes palladium and phosphorous. In oneembodiment, the palladium in the second layer 514 is deposited on thefirst layer 512 using electroless deposition techniques. In oneembodiment, the electroless deposition uses a chemical reaction todeposit the second layer 514, which results in an alloy of palladium andphosphorous deposited as the second layer 514.

In one embodiment, the second layer 514 is deposited to a thickness ofapproximately 30-100 nm. In one embodiment, the second layer 514 issubstantially amorphous on a nanometer scale dimension. In oneembodiment, the amorphous microstructure is substantially non-porous. Anon-porous microstructure provides an advantage of a continuous barrierlayer over underlying structure such as the first layer 512. Continuous,or non-porous layers help to prevent corrosion of underlying structuresuch as nickel in an embodiment of the first layer 512.

In one embodiment, the third layer 516 includes gold. In one embodiment,the gold in the third layer 516 is deposited on the second layer 514using electroless deposition techniques. In one embodiment, theelectroless deposition uses a gold cyanide solution to provide achemical reaction that deposits the gold in the third layer 516. In oneembodiment, the third layer 516 is deposited to a thickness ofapproximately 50-80 nm. FIG. 5B shows a close up view of amicrostructure of the interfacial layers 510 as shown at the processingstage in FIG. 5A.

One advantage of deposition of a palladium second layer 514 betweendeposition of a gold third layer 516 and first layer 512 includesreduced corrosion. When a gold cyanide chemical deposition is used overnickel, the nickel tends to corrode and degrade quality in theinterfacial layers 510. In contrast, electroless deposition of apalladium layer 514 over the nickel layer 512 does not lead toappreciable corrosion. Further, the palladium second layer 514 serves asa barrier layer during the gold third layer deposition, thus improvingquality in the interfacial layers 510.

FIG. 5C shows a further stage of processing of the grid array connectionstructure 500. A solder structure 530 is deposited onto the interfaciallayers 510 and the grid array connection structure 500 is reflowed toprovide the structure as shown in FIG. 5C. In one embodiment, the solderstructure 530 includes a solder ball, such as for use in a ball gridarray. One of ordinary skill in the art, having the benefit of thepresent disclosure will recognize that embodiments having other solderstructures such as pads, or other solder geometries are also within thescope of the invention. After the reflow process, a new interfacialregion 540 is created due to material transport such as diffusion andchemical reactions taking place in the grid array connection structure500.

FIG. 5D shows a microstructure of the interfacial region 540 afterreflow. A solder portion 550 is shown, that includes lead free solder inone embodiment. In several electronic device designs, lead free solderis being used for attachments such as chip package attachment to anadjacent circuit board. There are a number of reasons to use lead freesolders, including environmental concerns to reduce lead waste. Althoughenvironmental concerns are addressed using lead free solder, otherchallenges arise in manufacturing and design, such as increased hardnessand possible brittle failure of some lead free solders. In oneembodiment, the lead free solder 550 includes a SnAgCu soldercomposition. In one embodiment, the SnAgCu solder includes Sn3.0 Ag0.5Cu. In one embodiment, the SnAgCu solder includes any solder in a rangebetween Sn3.0-4.0 Ag0.5 Cu where numeric values indicate percent by Massin the solder.

FIG. 5D also shows a first layer 542 which corresponds to the nickelfirst layer 512 discussed above. A second layer 544 is shown over thefirst layer 542. A third layer 546 is located over the second layer 544,and a fourth layer 548 is shown located between the third layer 546 andthe solder portion 550.

In one embodiment, the first layer 542 is substantially the samecomposition as the first layer 512 before the reflow process. Similar toembodiments described above, in one embodiment, the first layer 542includes nickel. In one embodiment, the first layer includes nickel andphosphorous, as deposited in a an electroless deposition method.

In one embodiment, the second layer 544 includes nickel, tin, andphosphorous (NiSnP). One of ordinary skill in the art, having thebenefit of the present disclosure will recognize that while discretelayers and chemistries are labelled in the present figures forillustrative purposes, concentration gradients of various layerchemistries may not be discrete. In some embodiments, a concentrationprofile will vary across a layer as shown in the Figures due to reactionvariables or transport kinetics, etc.

In one embodiment, the third layer 546 includes tin, nickel, copper, andphosphorous (SnNiCuP). In one embodiment the third layer 546 is anintermetallic layer formed during the reflow process. In one embodiment,the third layer 546 is located approximately where the second layer 514from FIG. 5A was located before the reflow process. In one embodiment,the third layer 546 is formed by replacement of palladium by SnCugroups. In one embodiment, the palladium (Pd) from the second layer 514diffuses into the solder portion 550 during the reflow process, leavingbehind the third layer 546.

Although elements that are present are indicated in the description ofthe layers, the exact stoichiometry varies in some embodiments, unlessotherwise noted. For example, although description of the third layerindicates that in one embodiment SnCu replaces palladium (Pd) duringreflow, it is not necessary in all embodiments for only one atom of tinand one atom of copper to exactly replace one atom of palladium.

In one embodiment, the fourth layer 548 includes copper, nickel, andtin. In one embodiment the fourth layer 548 is an intermetallic layerformed during the reflow process. In one embodiment the fourth layerincludes crystalline grains of (CuNi)₆Sn₅. In embodiments withcrystalline grains, the stoichiometry of the grains is specific asindicated by the chemical notation (CuNi)₆Sn₅. in one embodiment thecrystalline grains of (CuNi)₆Sn₅ are elongated as indicated in FIG. 5D.In one embodiment, elongated grains are formed due to the presence ofthe second layer 514 in the structure prior to reflow. In oneembodiment, palladium controls the diffusion of nickel during reflow,resulting in a more elongated and finer grain structure than if thesecond layer 514 had not been present. One advantage of grain structuresin the fourth layer 548 as described above includes improved mechanicalproperties such as hardness and tensile strength, etc. that result in amore robust grid connection structure 500.

FIG. 6 shows one example of a method of forming a grid array connectionstructure as described in embodiments above. In one operation, a nickellayer is formed over at least one electrical connection surface. Inanother operation, a palladium layer is formed over the nickel layer. Inanother operation, a gold layer is formed over the palladium layer.Additional method operations follow in selected embodiments as describedabove. For example, in a land grid array example, a pin is brought intocontact with the gold layer, and improved properties such as hardnessand wear resistance provide a more robust land grid array connection. Inanother example, a solder structure is further formed over the goldlayer, and the structure is reflowed to create a ball grid arraystructure. Improved properties such as corrosion resistance and grainstructure provide a more robust ball grid array structure.

An example of an information handling system using processor chips isincluded to show an example of a higher level device application for thepresent invention. FIG. 7 is a block diagram of an information handlingsystem 700 incorporating at least one electronic assembly 710 utilizingan input/output connection structure in accordance with at least oneembodiment of the invention. In one embodiment, the input/outputconnection includes a land grid array connection. In one embodiment, theinput/output connection includes a ball grid array connection.

Information handling system 700 is merely one example of an electronicsystem in which the present invention can be used. In this example, theinformation handling system 700 includes a data processing system thatincludes a system bus 702 to couple the various components of thesystem. System bus 702 provides communications links among the variouscomponents of the information handling system 700 and can be implementedas a single bus, as a combination of busses, or in any other suitablemanner.

Electronic assembly 710 is coupled to system bus 702. Electronicassembly 710 can include any circuit or combination of circuits. In oneembodiment, electronic assembly 710 includes a processor 712 which canbe of any type. As used herein, “processor” means any type ofcomputational circuit, such as but not limited to a microprocessor, amicrocontroller, a complex instruction set computing (CISC)microprocessor, a reduced instruction set computing (RISC)microprocessor, a very long instruction word (VLIW) microprocessor, agraphics processor, a digital signal processor (DSP), or any other typeof processor or processing circuit.

Other types of circuits that can be included in electronic assembly 710are a custom circuit, an application-specific integrated circuit (ASIC),or the like, such as, for example, one or more circuits (such as acommunications circuit 714) for use in wireless devices like cellulartelephones, pagers, portable computers, two-way radios, and similarelectronic systems. The IC can perform any other type of function.

Information handling system 700 can also include an external memory 720,which in turn can include one or more memory elements suitable to theparticular application, such as a main memory 722 in the form of randomaccess memory (RAM), one or more hard drives 724, and/or one or moredrives that handle removable media 726 such as compact disks (CD),digital video disk (DVD), and the like. Examples of main memory 722include dynamic random access memory (DRAM), synchronous dynamic randomaccess memory (SDRAM), flash memory, static random access memory (SRAM),etc.

Information handling system 700 can also include a display device 716,one or more speakers 718, and a keyboard and/or controller 730, whichcan include a mouse, trackball, game controller, voice-recognitiondevice, or any other device that permits a system user to inputinformation into and receive information from the information handlingsystem 700.

Devices and methods described above provide a number of advantages. Forexample, land grid array structures are described with improvedmechanical properties such as hardness and abrasion resistance. Landgrid array structures are also shown that are less expensive tomanufacture due to reductions in material cost such as gold. Ball gridarray structures are also described with improved resistance tocorrosion during fabrication. Ball grid array structures are alsodescribed with improved mechanical properties to provide improved jointinterface strength in solder joints such as lead free solder joints.

Although selected advantages are detailed above, the list is notintended to be exhaustive. Although specific embodiments have beenillustrated and described herein, it will be appreciated by those ofordinary skill in the art that any arrangement which is calculated toachieve the same purpose may be substituted for the specific embodimentshown. This application is intended to cover any adaptations orvariations of embodiments described above. It is to be understood thatthe above description is intended to be illustrative, and notrestrictive, Combinations of the above embodiments, and otherembodiments will be apparent to those of skill in the art upon reviewingthe above description. The scope of the invention includes any otherapplications in which the above structures and fabrication methods areused. The scope of the invention should be determined with reference tothe appended claims, along with the full scope of equivalents to whichsuch claims are entitled.

1-9. (canceled)
 10. An electronic device comprising: a chip package thatincludes a metallic connection structure; a circuit board; and a chipconnection structure coupled with the chip package and the circuitboard, wherein the chip connection structure includes: a first layerthat includes nickel (Ni) coupled with the metallic connectionstructure; a solder structure; an intermetallic layer that includescopper (Cu), nickel (Ni) and tin (Sn) between the first layer and thesolder structure; and a second layer that includes tin (Sn), nickel(Ni), copper (Cu) and phosphorous (P) between the intermetallic layerand the first layer.
 11. The electronic device of claim 10, wherein theintermetallic layer includes crystalline grains.
 12. The electronicdevice of claim 11, wherein the crystalline grains are elongated. 13.The electronic device of claim 10, wherein the intermetallic layerincludes (CuNi)₆Sn₅.
 14. The electronic device of claim 10, wherein thefirst layer further includes phosphorous (P).
 15. The electronic deviceof claim 10, wherein the solder structure includes tin (Sn), silver (Ag)and copper (Cu).
 16. The electronic device of claim 10, wherein themetallic connection structure comprises copper (Cu).
 17. The electronicdevice of claim 10, wherein the solder structure includes a ball gridarray solder ball.
 18. The electronic device of claim 10, wherein thechip connection structure provides an input/output connection betweenthe chip package and the circuit board.
 19. The electronic device ofclaim 10, wherein the solder structure includes palladium (Pd).
 20. Amethod comprising: forming, on a metallic connection structure of a chippackage, a first layer that includes nickel (Ni); forming a second layerthat includes tin (Sn), nickel (Ni), copper (Cu) and phosphorous (P);forming an intermetallic layer that includes copper (Cu), nickel (Ni)and tin (Sn), wherein a location of the second layer is between alocation of the first layer and a location of the intermetallic layer;and forming a solder structure, wherein the location of theintermetallic layer is between the location of the second layer and alocation of the solder structure.
 21. The method of claim 20, whereinthe intermetallic layer includes crystalline grains.
 22. The method ofclaim 21, wherein the crystalline grains are elongated.
 23. The methodof claim 20, wherein the intermetallic layer includes (CuNi)₆Sn₅. 24.The method of claim 20, wherein the first layer further includesphosphorous (P).
 25. The method of claim 20, wherein the solderstructure includes tin (Sn), silver (Ag) and copper (Cu).
 26. The methodof claim 20, wherein the metallic connection structure comprises copper(Cu).
 27. The method of claim 20, wherein the solder structure includesa ball grid array solder ball.
 28. The method of claim 20, furthercomprising providing, by the chip connection structure an input/outputconnection between the chip package and the circuit board.
 29. Themethod of claim 20, wherein the solder structure includes palladium(Pd).